Clip Bond "DCA1000"
Clip Bonder - Die bonder for power semiconductors, chip and clip bonding, with optional appearance inspection and NG product punching unit support.
The "DCA1000" is a die and clip bonder for power semiconductors. (The device photo shows the configuration of a die bonder + clip bonder + appearance inspection mechanism) 【Specifications】 ■Joining Process Joining of solder-coated chips and joining of lead chips using ribbon solder ■Chip Size □1.0~6.0mm ■Lead Chip Size 8.5x2.5mm, 8.5x3.5mm, etc. ■Bonding Accuracy (XY) +/-150μm ■Bonding Accuracy (Θ) +/-5° ■Bond/Pick Load 40~200gf ■Compatible Work Lead Frame ■Compatible Width Up to 30mm ■Chip/Lead Supply Parts Feeder Supply ■Machine Cycle Time 0.9sec (1 chip) 1.6sec (2 chips) ■Transport Method Pin Transport ■External Dimensions 2,300x1,000x1,490mm ■Weight 1,200kg ■Main Options Backside recognition for chip orientation determination, appearance inspection, and punching of defective products *For more details, please refer to the catalog or feel free to contact us.
- Company：テクサス
- Price：Other
